Examples of indium applications and structures in the United States and Japan.
Table 1 Application examples and structure of indium (%)
years | Country | application | ||||
ITO | Low melting alloy | Semiconductor + phosphor | Bearing | other | ||
1985 | United States | 25.0 | 31.7 | 5.8 | - | 37.5 |
Japan | 28.6 | 24.6 | 19.6 | 4.1 | 23.1 | |
1996 | United States | 45 | 35 | 15 | - | 5 |
Japan | 60.0 | 20.9 | 16.0 | 1.0 | 3.1 | |
1997 | United States | 45 | 35 | 15 | - | 5 |
Japan | 79.5 | 11.6 | 7.2 | 0.4 | 1.3 | |
1998 | United States | 50 | 33 | 12 | - | 5 |
Japan | 78.9 | 2.9 | 13.0 | 0.5 | 4.7 | |
1999 | United States | 50 | 33 | 12 | - | 5 |
Japan | 81.9 | 2.2 | 11.8 | 0.4 | 3.7 | |
2000 | United States | 49 | 33 | 14 | - | 4 |
Japan | 80.2 | 6.2 | 11.4 | - | 2.5 | |
2001 | United States | 49 | 33 | 15 | - | 3 |
Japan | 83.3 | 4.0 | 11.6 | - | 1.5 |
1. Indium compound semiconductors are used in optical communication, infrared detectors, light-emitting diodes, high-efficiency photovoltaic cells, and high-speed transistors.
Second, ITO transparent electrode is mainly used for liquid crystal display, conductive polymer and solar cell, also used as electroluminescent element for defogging/ice device of airplane car and other spoiler, used as transparent heat reflector and used as infrared window , architectural glass windows and oven door.
3. Indium and indium-based alloys have wear-resisting and corrosion-resistant properties and good mechanical properties. They are specially used as high-speed Engine bearings, acid-base environments and marine instruments, decorative and souvenir coatings.
Fourth, indium and gallium, bismuth, lead, cadmium, tin, thallium, etc 1.45-154 ℃ series fluxing low (see Table 2), is automatically controlled, the filler profile of the workpiece, the clip jewelry processing material (after Both are easy to remove and reuse after use). Used as aluminum wire joint coating and control rods for the nuclear industry.
Table 2 Indium-based low-melting alloy (the remainder of the component is indium)
Melting point / °C | 1.45 | 18 | 33 | 44.5 | 46.5 | 54 | 57.5 | |
Component /% | Sn | 12.5 | 12.5 | 8 | 8.3 | 10.8 | 11.5 | 12 |
Pb | 25 | 25 | 21.1 | 22.6 | 22.4 | 17.9 | 18 | |
Bi | 50 | 50 | 42.9 | 44.7 | 40.6 | 49.1 | 49 | |
Cd | 12.5 | - | 5 | - | 8.2 | 0.5 | - | |
other | - | - | - | - | - | - | - | |
Melting point / °C | 60 | 70 | 81 | 90.5 | 93 | 108 | 109.5 | |
Component /% | Sn | - | 1.0 | 16.3 | 16-18 | 42 | 46 | 48 |
Pb | - | 39.2 | - | 30-32 | - | - | - | |
Bi | 30.8 | 50.3 | 54.0 | 52 | - | - | - | |
Cd | 7.5 | 8.0 | - | - | 14 | - | - | |
other | - | - | - | - | - | Zn18 | - | |
Melting point / °C | 111.5 | 116 | 122.5 | 126 | 141.5 | 152 | 154 | |
Component /% | Sn | - | - | - | 37.5 | - | - | - |
Pb | 44 | - | - | 37.5 | - | - | - | |
Cd | 55 | 24.25 | 27 | - | - | - | - | |
other | - | Zn1.75 | - | - | Zn2 | Ge0.6 | Ge0.5 |
5. Indium-based solders with melting points of 47-234 ° C (see Table 3), such as indium and tin, antimony and lead, have good electrical conductivity, mechanical properties and anti-corrosion properties. It is required for both electronic and cryogenic physics, as well as a special solder for machinery and chlor-alkali industries.
Table 3 Indium-based solder (the remainder of the component is indium)
Melting point / °C | 47 | 72 | 77.5 | 79 | 93 | |
Component /% | Sn | - | - | - | 17 | 42 |
Pb | - | - | - | - | - | |
Bi | 81.9 | 33.7 | 48.5 | 57 | - | |
Cd | - | - | 16 | - | 14 | |
Ag | - | - | - | - | - | |
Melting point / °C | 109 | 116 | 118 | 123 | 144 | |
Component /% | Sn | - | - | 48 | - | - |
Pb | - | 50 | - | - | - | |
Bi | 67 | - | - | - | - | |
Cd | - | - | - | 25 | - | |
Ag | - | - | - | - | 10 | |
Melting point / °C | 147 | 151.5 | 153 | 158 | 234 | |
Component /% | Sn | - | - | - | - | - |
Pb | 5 | - | 1.5 | 20.7 | 75 | |
Bi | - | - | - | - | - | |
Cd | 5 | - | - | - | - | |
Ag | - | 5 | - | - | - |
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